28-3575-16

Manufacturer :

Aries Electronics

Product Category :

Sockets for ICs, Transistors

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

10.0µin (0.25µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

Polyphenylene Sulfide (PPS), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

28 (2 x 14)

Operating Temperature :

-

Packaging :

Bulk

Part Status :

Active

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Series :

57

Termination :

Solder

Type :

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing