TS391LT10

Manufacturer
Chip Quik Inc.
Product Category
Solder
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer :
Chip Quik Inc.
Product Category :
Solder
Composition :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter :
-
Flux Type :
No-Clean
Form :
Syringe, 1.23 oz (35g), 10cc
Melting Point :
281°F (138°C)
Part Status :
Active
Process :
Lead Free
Series :
-
Shelf Life :
12 Months (Date of Manufacture)
Type :
Solder Paste
Wire Gauge :
-
Datasheets
TS391LT10

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