SMDLTLFP250T4

SMDLTLFP250T4

Manufacturer: Chip Quik Inc.

Product Category: Solder

Description: SOLDER PASTE LOW TEMP T4 250G

Manufacturer :: Chip Quik Inc.

Product Category :: Solder

Composition :: Bi57.6Sn42Ag0.4 (57.6/42/0.4)

Diameter :: -

Flux Type :: No-Clean

Form :: Jar, 8.8 oz (250g)

Melting Point :: 281°F (138°C)

Part Status :: Active

Process :: Lead Free

Series :: -

Shelf Life :: 6 Months (Date of Manufacture) (Refrigerated)

Type :: Solder Paste

Wire Gauge :: -

Datasheets: SMDLTLFP250T4

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