BDN15-3CB/A01

Manufacturer
CTS Thermal Management Products
Product Category
Thermal - Heat Sinks
Description
HEATSINK CPU W/ADHESIVE 1.51"SQ
Manufacturer :
CTS Thermal Management Products
Product Category :
Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.355" (9.02mm)
Length :
1.510" (38.35mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Part Status :
Active
Power Dissipation @ Temperature Rise :
-
Series :
BDN
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
4.50°C/W @ 400 LFM
Thermal Resistance @ Natural :
15.10°C/W
Type :
Top Mount
Width :
1.510" (38.35mm)
Datasheets
BDN15-3CB/A01

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