- Manufacturer:
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- CUI Inc. (5)
- Type:
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- Width:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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10 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions Inc. | HEATSINK TO-252 D-P... |
|
1 | 848 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, STAMPI... |
|
10,000 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, STAMPI... |
-
|
1 | 2,088 | Get Quote | ||
CUI Inc. | HEAT SINK, STAMPI... |
|
1 | 2,088 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, STAMPI... |
|
150 | 1,950 | Buy Now Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
-
|
1 | 2,828 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
|
1 | 2,828 | Buy Now Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
|
250 | 2,750 | Buy Now Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK TO-263 CO... |
|
1 | 2,141 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, STAMPI... |
|
5,000 | 0 | Get Quote |