- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote |
