- Manufacturer：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
10 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
25 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
100 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
25 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
500 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
100 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
1,000 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
500 | 0 | Get Quote | |
|
|
American Technical Ceramics | THERMAL CONDUCTO... |
|
1,000 | 0 | Get Quote | |
|
|
Apex Microtechnology | HEATSINK 10P DIP |
|
1 | 4 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
|
1 | 155 | Buy Now Get Quote |
