- Manufacturer:
-
- Wakefield-Vette (1)
- Material:
-
- Type:
-
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Material Finish:
-
6 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
2,500 | 0 | Get Quote | ||
Assmann WSW Components | HEATSINK CPU FOR... |
|
1 | 0 | Get Quote | ||
Assmann WSW Components | HEATSINK CPU FOR... |
|
1 | 0 | Get Quote | ||
Assmann WSW Components | HEATSINK CPU FOR... |
|
1 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK POWER T... |
|
1 | 156 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 H31.7... |
|
1 | 2,986 | Buy Now Get Quote |