- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
5 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,500 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
|
1 | 8,150 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218 W/P... |
|
1 | 4,599 | Buy Now Get Quote |
