- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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7 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,250 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-202 CL... |
|
10,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SN... |
|
1 | 9,089 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SN... |
|
1 | 5,007 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 CL... |
|
1 | 7,031 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 2.5W... |
|
1 | 2,748 | Buy Now Get Quote |