- Manufacturer:
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- Comair Rotron (1)
- Ohmite (2)
- Wakefield-Vette (1)
- Part Status:
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- Material:
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- Length:
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- Width:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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10 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
-
|
0 | 0 | Get Quote | ||
Comair Rotron | HEATSINK STAMP 9.... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK CPU 35MM... |
|
1 | 934 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
8,000 | 0 | Get Quote | ||
Ohmite | HEATSINK FOR TO-1... |
|
1 | 101 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SN... |
|
1 | 9,089 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 9,880 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SN... |
|
1 | 5,007 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-1... |
|
10 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
15,000 | 0 | Get Quote |