- Manufacturer：
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- Comair Rotron (2)
- Wakefield-Vette (3)
- Part Status：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 6.... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK DPAK SM... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 CL... |
|
1 | 3,574 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 CL... |
|
1 | 8,501 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 VE... |
|
1 | 15,369 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 W/T... |
|
1 | 20,824 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK DPAK SM... |
|
1 | 40,590 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 0 | Get Quote | |
|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote |
