- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK SLIM VE... |
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|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
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|
0 | 0 | Get Quote |
