- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
6 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | 65245 EXTRUSION 1.65X... |
|
1 | 13 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PO... |
|
1 | 4,948 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
|
1 | 3,083 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218 10W... |
|
1 | 3,755 | Buy Now Get Quote |