- Manufacturer：
-
- Comair Rotron (2)
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
8 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 3,729 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 T... |
-
|
1 | 10,737 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 T... |
|
1 | 10,737 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 T... |
|
250 | 10,500 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK COPPER ... |
|
1 | 4,792 | Buy Now Get Quote |
