- Manufacturer：
-
- Comair Rotron (1)
- Wakefield-Vette (2)
- Series：
-
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 24... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
|
1,000 | 0 | Get Quote | |
|
|
Apex Microtechnology | HEATSINK 6P DIP |
|
1 | 12 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 4,067 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
|
1 | 1,395 | Buy Now Get Quote |
