- Part Status：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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7 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK CPU 27.9M... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK FOR BGA... |
|
1,200 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
|
1 | 3,800 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 27.9M... |
|
1 | 5,625 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
|
1 | 2,800 | Buy Now Get Quote |
