- Manufacturer：
-
- Series：
-
- Material：
-
- Type：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
5 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Sanyo Denki America Inc. | P3, 800MHZ, FC-PGA |
|
80 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | |
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 56MM X 56... |
|
1 | 126 | Buy Now Get Quote | |
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 BLA... |
|
1 | 823 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
18,000 | 0 | Get Quote |
