- Manufacturer：
-
- Comair Rotron (1)
- CUI Inc. (1)
- Ohmite (8)
- Wakefield-Vette (15)
- Part Status：
-
- Material：
-
- Length：
-
- Width：
-
- Diameter：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
43 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 22... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,500 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,000 | 0 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
0 | 21 | Buy Now Get Quote | |
|
|
Ohmite | TO-268 HEAT SINK /P... |
|
250 | 0 | Get Quote | |
|
|
Ohmite | TO-263 HEAT SINK / P... |
|
250 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,000 | 0 | Get Quote | |
|
|
Ohmite | TO-268 HEAT SINK /P... |
|
250 | 0 | Get Quote | |
|
|
Ohmite | TO-263 HEAT SINK / P... |
|
250 | 0 | Get Quote | |
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-252 D-P... |
|
1 | 848 | Buy Now Get Quote | |
|
|
Advanced Thermal Solutions Inc. | HEATSINK TRIPLE ... |
|
1 | 1,458 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
0 | 3,794 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
0 | 2,584 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | TO-5 PUSH-ON HEATS... |
|
5,000 | 0 | Get Quote | |
|
|
Advanced Thermal Solutions Inc. | HEATSINK 12-SIP W/... |
|
1,000 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
|
513 | 0 | Get Quote |
