- Manufacturer:
-
- Comair Rotron (1)
- CUI Inc. (4)
- Ohmite (2)
- Wakefield-Vette (2)
- Part Status:
-
- Material:
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- Package Cooled:
-
- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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19 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Comair Rotron | HEATSINK STAMP 12... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | ||
Apex Microtechnology | HEATSINK WAKEFIE... |
|
1 | 0 | Get Quote | ||
CTS Thermal Management Products | HEATSINK PWR W/PI... |
|
1,000 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
|
700 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,500 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,500 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,350 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
900 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
900 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
900 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
|
1 | 2,113 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 1,584 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
1 | 96 | Buy Now Get Quote | ||
Assmann WSW Components | HEATSINK ALUM AN... |
|
1 | 897 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PO... |
|
1 | 3,410 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218/TO... |
|
1 | 7,199 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
1 | 219 | Buy Now Get Quote |