- Material:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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11 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
2,400 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
900 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,400 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,850 | 0 | Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
1 | 0 | Get Quote | ||
CTS Thermal Management Products | HEATSINK PWR W/PI... |
|
1 | 1,232 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
1 | 30 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 H=2... |
|
1 | 8,331 | Buy Now Get Quote |