- Manufacturer:
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- Wakefield-Vette (1)
- Series:
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- Material:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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13 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions Inc. | HEATSINK 21X21X17.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X24.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X24.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X19.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X12.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X19.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X14.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X14.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X7.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X9.5M... |
|
10 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK 21X21X9.5M... |
|
10 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK CPU 21MM... |
|
1,600 | 0 | Get Quote | ||
Assmann WSW Components | HEATSINK CPU XCU... |
|
1 | 0 | Get Quote |