- Manufacturer：
-
- CUI Inc. (2)
- Wakefield-Vette (2)
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
CUI Inc. | HEATSINK HALF BR... |
-
|
0 | 0 | Get Quote | |
|
|
CUI Inc. | HEATSINK HALF BR... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
-
|
0 | 0 | Get Quote |
