- Manufacturer:
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- CUI Inc. (4)
- Material:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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6 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,000 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,500 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218 SO... |
|
1 | 4,441 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 592 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 746 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 746 | Buy Now Get Quote |