- Series：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
520 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
|
513 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
|
513 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
|
513 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
|
513 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
|
1 | 552 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
|
1 | 1,844 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
|
1 | 4,097 | Buy Now Get Quote |
