- Manufacturer：
-
- Comair Rotron (32)
- CUI Inc. (78)
- Ohmite (88)
- Wakefield-Vette (68)
- Series：
-
- Part Status：
-
- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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521 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
-
|
0 | 0 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
25 | 0 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
25 | 0 | Get Quote | |
|
|
Apex Microtechnology | HEATSINK THERMAL... |
|
1 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 6.... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 22... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK EXTRUDE... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 12... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK EXTRUDE... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK EXTRUD ... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 9.... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK EXTRUDE... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote |
