- Manufacturer：
-
- DFRobot (1)
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
3 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Delta Electronics | HEATSINK ASSY IN... |
|
768 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,000 | 0 | Get Quote | |
|
|
DFRobot | RASPBERRY PI PUR... |
|
1 | 475 | Buy Now Get Quote |
