- Manufacturer：
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- Comair Rotron (1)
- CUI Inc. (1)
- Series：
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- Part Status：
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- Length：
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- Width：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 9.... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
6,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
7,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
8,000 | 0 | Get Quote | |
|
|
Apex Microtechnology | HEATSINK SIP 1.33C... |
|
1 | 6 | Buy Now Get Quote | |
|
|
CUI Inc. | HEATSINK TO-220 2.6W... |
|
1 | 4,800 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 CL... |
|
1 | 14,255 | Buy Now Get Quote |
