- Manufacturer：
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- Comair Rotron (1)
- CUI Inc. (1)
- Wakefield-Vette (3)
- Material：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 19... |
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|
0 | 0 | Get Quote | |
|
|
CUI Inc. | HEATSINK HALF BR... |
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|
0 | 0 | Get Quote | |
|
|
GE Critical Power | HEATSINK 2.27L X.45"... |
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|
0 | 0 | Get Quote | |
|
|
GE Critical Power | HEATSINK 2.39L X.45"... |
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|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
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|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
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|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
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|
0 | 0 | Get Quote | |
|
|
CTS Thermal Management Products | CLIP W/LOCK FOR H... |
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|
0 | 0 | Get Quote |
