Material:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
Image Part Manufacturer Description Price MOQ Stock Action
834100T00000 Comair Rotron
HEATSINK STAMP 22...
-
0 0 Get Quote
833502B00000 Comair Rotron
HEATSINK STAMP 9....
-
0 0 Get Quote
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