- Manufacturer:
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- CUI Inc. (1)
- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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4 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | 65715 EXTRUSION 0.39X... |
|
1 | 6 | Buy Now Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK TO-220 AL... |
|
1 | 1,439 | Buy Now Get Quote | ||
Seeed Technology Co., Ltd | RASPBERRYPI ULTI... |
|
1 | 75 | Buy Now Get Quote | ||
CUI Inc. | HEATSINK TO-220 4.4W... |
|
1,000 | 0 | Get Quote |