- Manufacturer：
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- Comair Rotron (1)
- CUI Inc. (1)
- Part Status：
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- Material：
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- Shape：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 20... |
-
|
0 | 0 | Get Quote | |
|
|
t-Global Technology | HEATSINK CER 20X20... |
|
1 | 235 | Buy Now Get Quote | |
|
|
t-Global Technology | XL25 CERAMIC 20X20M... |
|
1 | 809 | Buy Now Get Quote | |
|
|
t-Global Technology | HEATSINK CER 20X20... |
|
1 | 1,331 | Buy Now Get Quote | |
|
|
t-Global Technology | XL25 CERAMIC 20X20M... |
|
1 | 3,295 | Buy Now Get Quote | |
|
|
t-Global Technology | XL25 CERAMIC BOAR... |
|
1 | 5,176 | Buy Now Get Quote | |
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
|
1,000 | 0 | Get Quote | |
|
|
CUI Inc. | HEATSINK TO-220 3.6W... |
|
3,000 | 0 | Get Quote |
