- Manufacturer：
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- Comair Rotron (1)
- CUI Inc. (1)
- Wakefield-Vette (1)
- Part Status：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 22... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
8,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PA... |
|
1 | 18,233 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PA... |
|
250 | 17,500 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
|
1 | 14,042 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
|
5,000 | 0 | Get Quote | |
|
|
CUI Inc. | HEAT SINK, STAMPI... |
|
5,000 | 0 | Get Quote |
