- Manufacturer:
-
- Material:
-
- Type:
-
- Shape:
-
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
5 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,000 | 0 | Get Quote | ||
Assmann WSW Components | HEAT SINK ALUM DP... |
|
1 | 4,669 | Buy Now Get Quote | ||
Assmann WSW Components | HEAT SINK ALUM DP... |
-
|
1 | 24,972 | Get Quote | ||
Assmann WSW Components | HEAT SINK ALUM DP... |
|
1 | 24,972 | Buy Now Get Quote | ||
Assmann WSW Components | HEAT SINK ALUM DP... |
|
400 | 24,800 | Buy Now Get Quote |