- Manufacturer:
-
- Comair Rotron (3)
- CUI Inc. (4)
- Wakefield-Vette (8)
- Part Status:
-
- Material:
-
- Length:
-
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
-
39 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Comair Rotron | HEATSINK EXTRUD ... |
-
|
0 | 0 | Get Quote | ||
Comair Rotron | HEATSINK STAMP 12... |
-
|
0 | 0 | Get Quote | ||
Comair Rotron | HEATSINK EXTRUD ... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 W/P... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
2,400 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 W/S... |
|
1,000 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
|
700 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,500 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
6,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,750 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,500 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,500 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,500 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,400 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,250 | 0 | Get Quote |