- Manufacturer:
-
- Comair Rotron (1)
- Ohmite (12)
- Wakefield-Vette (4)
- Part Status:
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- Material:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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19 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Ohmite | TO-263 SMD HEAT SIN... |
-
|
0 | 0 | Get Quote | ||
Ohmite | TO-263 SMD HEAT SIN... |
-
|
0 | 0 | Get Quote | ||
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | ||
Ohmite | TO-263 HEAT SINK / P... |
|
250 | 0 | Get Quote | ||
Ohmite | TO-263 HEAT SINK / P... |
|
250 | 0 | Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
-
|
1 | 839 | Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
1 | 839 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
200 | 800 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
0 | 3,794 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
0 | 2,584 | Buy Now Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,000 | 0 | Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
-
|
1 | 57 | Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
1 | 57 | Buy Now Get Quote | ||
Ohmite | HEATSINK FOR TO-2... |
|
200 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 11,711 | Buy Now Get Quote | ||
Wakefield-Vette | TO-263 HEAT SINK AN... |
|
1 | 947 | Buy Now Get Quote | ||
Wakefield-Vette | TO-263 HEAT SINK AN... |
-
|
1 | 1,512 | Get Quote | ||
Wakefield-Vette | TO-263 HEAT SINK AN... |
|
1 | 1,512 | Buy Now Get Quote | ||
Wakefield-Vette | TO-263 HEAT SINK AN... |
|
250 | 1,250 | Buy Now Get Quote |