- Manufacturer：
-
- Comair Rotron (1)
- CUI Inc. (1)
- Ohmite (12)
- Wakefield-Vette (4)
- Part Status：
-
- Material：
-
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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25 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Ohmite | TO-263 SMD HEAT SIN... |
-
|
0 | 0 | Get Quote | |
|
|
Ohmite | TO-263 SMD HEAT SIN... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
-
|
0 | 0 | Get Quote | |
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
0 | 0 | Get Quote | |
|
|
Ohmite | TO-263 HEAT SINK / P... |
|
250 | 0 | Get Quote | |
|
|
Ohmite | TO-263 HEAT SINK / P... |
|
250 | 0 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
-
|
1 | 839 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
1 | 839 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
200 | 800 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
0 | 3,794 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
0 | 2,584 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
8,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-202 CL... |
|
10,000 | 0 | Get Quote | |
|
|
CUI Inc. | HEAT SINK, STAMPI... |
|
10,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,000 | 0 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
-
|
1 | 57 | Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
1 | 57 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
200 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 | 11,711 | Buy Now Get Quote |
