- Manufacturer：
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- Comair Rotron (1)
- Wakefield-Vette (9)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 9.... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 27.9M... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
-
|
0 | 0 | Get Quote |
