- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK 2TO-3 & 12P... |
|
1 | 0 | Get Quote | |
|
|
Apex Microtechnology | HEATSINK SIP 1.33C... |
|
1 | 6 | Buy Now Get Quote |
