- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK 10P DIP |
|
1 | 4 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK 8P TO-3 .9... |
|
1 | 7 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
|
1 | 33 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK 12P PWR S... |
|
1 | 87 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
|
1 | 155 | Buy Now Get Quote |
