- Manufacturer：
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- Comair Rotron (1)
- CUI Inc. (1)
- Wakefield-Vette (2)
- Part Status：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK EXTRUD ... |
-
|
0 | 0 | Get Quote | |
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,500 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
6,000 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,750 | 0 | Get Quote | |
|
|
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 W/P... |
|
1 | 6,826 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 W/P... |
|
1 | 5,889 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK TO-220 VR... |
|
1 | 1,950 | Buy Now Get Quote |
