- Manufacturer:
-
- CUI Inc. (2)
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
4 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Assmann WSW Components | HEATSINK TO-220/TO... |
|
1 | 717 | Buy Now Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,200 | 0 | Get Quote | ||
Advanced Thermal Solutions Inc. | HEATSINK TO-220 DU... |
|
1,000 | 0 | Get Quote |