- Manufacturer：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
CTS Thermal Management Products | HEATSINK CPU W/AD... |
|
1 | 546 | Buy Now Get Quote | |
|
|
CTS Thermal Management Products | HEATSINK CPU W/AD... |
|
1 | 1,136 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 ST... |
|
1 | 5,326 | Buy Now Get Quote |
