- Manufacturer：
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- Comair Rotron (1)
- CUI Inc. (3)
- Part Status：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
0 | 0 | Get Quote | |
|
|
CUI Inc. | HEAT SINK, STAMPI... |
-
|
1 | 2,088 | Get Quote | |
|
|
CUI Inc. | HEAT SINK, STAMPI... |
|
1 | 2,088 | Buy Now Get Quote | |
|
|
CUI Inc. | HEAT SINK, STAMPI... |
|
150 | 1,950 | Buy Now Get Quote | |
|
|
Assmann WSW Components | HEATSINK TO-263 19.3... |
|
1 | 605 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
|
1 | 6,994 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 |
-
|
1 | 15,795 | Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 |
|
1 | 15,795 | Buy Now Get Quote | |
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 |
|
125 | 15,625 | Buy Now Get Quote |
