- Manufacturer：
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- Wakefield-Vette (1)
- Series：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK OPEN FR... |
|
1 | 0 | Get Quote | |
|
|
Apex Microtechnology | HEATSINK 12P DIP |
|
1 | 31 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK 12P DIP .... |
|
1 | 3 | Buy Now Get Quote | |
|
|
Apex Microtechnology | HEATSINK TO3 |
|
1 | 125 | Buy Now Get Quote | |
|
|
Wakefield-Vette | HEATSINK POWER N... |
|
1 | 145 | Buy Now Get Quote |
