- Manufacturer:
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- Comair Rotron (1)
- CUI Inc. (1)
- Part Status:
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- Material:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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2 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Comair Rotron | HEATSINK EXTRUDE... |
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|
0 | 0 | Get Quote | ||
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 713 | Buy Now Get Quote |