- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
|---|---|---|---|---|---|---|---|
|
CUI Inc. | HEAT SINK, EXTRUS... |
|
1,500 | 0 | Get Quote | |
|
|
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 592 | Buy Now Get Quote | |
|
|
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 746 | Buy Now Get Quote | |
|
|
CUI Inc. | HEAT SINK, EXTRUS... |
|
1 | 746 | Buy Now Get Quote | |
|
|
Ohmite | HEATSINK FOR TO-2... |
|
1 | 2,134 | Buy Now Get Quote |
