- Manufacturer:
-
- Comair Rotron (2)
- CUI Inc. (12)
- Ohmite (2)
- Wakefield-Vette (15)
- Part Status:
-
- Material:
-
- Width:
-
- Diameter:
-
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
59 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action |
---|---|---|---|---|---|---|---|
Comair Rotron | HEATSINK EXTRUD ... |
-
|
0 | 0 | Get Quote | ||
Comair Rotron | HEATSINK EXTRUDE... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 W/P... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 W/P... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 W/P... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
-
|
0 | 0 | Get Quote | ||
CTS Thermal Management Products | HEATSINK VERT .750... |
-
|
0 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 W/P... |
|
1,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,750 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK |
|
600 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,250 | 0 | Get Quote | ||
Ohmite | BLACK ANODIZED H... |
|
1 | 258 | Buy Now Get Quote | ||
Wakefield-Vette | HEATSINK MULTIWA... |
|
1,200 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,000 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,000 | 0 | Get Quote | ||
Wakefield-Vette | HEATSINK TO-220 VE... |
|
1,100 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
4,500 | 0 | Get Quote | ||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,250 | 0 | Get Quote |